Active and intelligent packaging for the Chinese market

AIPIA China Summit, Shanghai 18-19 July

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The upcoming AIPIA China Summit (Shanghai 18-19 July) sets out clearly the advantages of Active and Intelligent Packaging technologies for many sectors of Chinese manufacturing. The event is co-organized by AIPIA, the Active & Intelligent Packaging Industry Association and Prime Business Consulting, AIPIA’s representatives in China.

The program has been designed to explain why this huge market needs smart packaging and how the different technologies can be adapted to offer real value to the Chinese packaging sector as well as end users in the food and beverage, pharmaceutical and cosmetics, and personal care industries – all of which are undergoing enormous expansion.

A keynote address by Talkin’ Things, the first company in the world to offer an NFC-based Smart Packaging System which integrates iPhone and Android users, will set the scene. Other presentations will show solutions to China’s growing counterfeit goods problem and how to improve supply chain management and control. In addition brand owners, such as Mondelez, will share their active and intelligent packaging experiences.

Leading companies at the cutting edge of active and intelligent packaging development will take part in the show. These include Amcor, which will demonstrate how it is able to add cutting-edge technology on to traditional packaging solutions by accurately predicting the trend of the market; Systech will explain how companies can make their current packaging uniquely identifiable to prevent counterfeiting and diversion; while Evigence Sensors will explain how item level temperature monitoring can help reduce waste and improve the bottom line.

Active and intelligent packaging leaders from all across the value chain have signed up to take part in this ground-breaking Summit. Leading innovators such as EVRYTHNG (digital ecosystems), Stora Enso (automated authentication and sustainable intelligent packaging), Kezzler (consumer interaction) and NXP (RFID and NFC) will talk about applications relevant to the Chinese marketplace. In total 20 experts across the entire A&IP ecosystem will share their expertise.

An important feature of the Summit is a speed dating session where active and intelligent packaging practitioners will have 2 minutes to get in contact with the many brands already signed up to attend. There will then be the opportunity to continue one-to-one conversations after the session ends.

Eef de Ferrante, managing director of AIPIA, urged the many Chinese brand owners, packaging manufacturers and converters, logistics companies and packaging designers to sign up for the event.

“This is a unique opportunity to discover how A&IP technologies can increase profitability, reduce waste and enhance sustainability,” he said. “APAC, but particularly China, has the most potential growth prospects for active and intelligent packaging on the planet. We believe the time is perfect to offer China’s packaging professionals and brand owners – both national and international – a window into the complete world of active and intelligent packaging solutions.”