Ramcko
Jigneshkumar Patel, director of Ramcko Machinery at PlastIndia 2026. Photo PSA

Ahmedabad-based Ramcko Machinery, a manufacturer of plastic bag and pouch machines—including side seal, bottom seal, zipper, stand-up, and vaccum seal pouching technology—showcased its machinery at PlastIndia at Delhi’s Pragati Maidan from 5-10 February 2026.

In its fourth appearance at the trade show, the company spotlighted its latest innovation— a 1200-mm flying knife high-speed bottom seal machine. It boasts 90% sales to overseas markets.

The machine is designed for versatility, serving industries ranging from pharmaceuticals and chemicals to bulk packaging. Unlike traditional mechanical setups, Ramcko’s new model is driven by advanced servo and AC motors, eliminating the need for gears and chains, reducing downtime, and is capable of handling bag thicknesses from 20 to 500 microns.

While the company has been in operation for 13 years, its primary focus has been the international market. Currently, 90% of Ramcko’s production is exported to regions such as Africa, the Middle East, and South America. However, the company’s presence at PlastIndia signals a strategic shift.

“We know the local market’s potential,” Jigneshkumar Patel, director of Ramcko Machinery, stated, noting the company aims to increase its domestic footprint as India’s industrial sector grows.

With a focus on “no-touch” automated packaging and the latest upgraded technologies, Ramcko remains optimistic about the market, reporting strong interest from domestic attendees in the show.

We customize our products at special prices. We are undertaking extensive digital marketing efforts and attending all major exhibitions to meet customers in person and gather their requirements. Our high-tech products are designed with customers’ budget and needs in mind,” Patel said.

Ramcko Machinery used the PlastIndia show to meet plastic bag or pouch manufacturers and discuss growing trends in technology. It received good responses from visitors, with serious inquiries on the technology showcased at the meet.

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