Syntegon
Quick and easy format changeovers enable the processing of different shapes and sizes of biscuits on the same machine while ensuring high uptime, making Pack 301 ideal for changing market requirements.

Syntegon will participate in Anuga FoodTec India which has emerged as South Asia’s premier platform for innovations in food processing, packaging, and automation. Syntegon will spotlight two advanced packaging systems designed to meet the dynamic needs of India’s fast-growing snack and biscuit market on stand L02. 

Urbanization and shifting consumption habits are fueling growth in India’s snacks and biscuits sector. With more consumers replacing traditional meals with convenient, portion-sized options, the demand for both indulgent and health-focused products—such as gluten-free, low-calorie, or high-fiber varieties—is growing rapidly. 

This presents new challenges for manufacturers, particularly in processing and packaging delicate, healthier snack items. “The challenge lies in increasing output without compromising product quality,” says Ashish Deshpande, managing director at Syntegon Technology India. “Our solutions address exactly that – offering both high efficiency and maximum product protection.” 

SVL 2310 – a game changer for snack manufacturers 

Chips per minute is designed to efficiently package snacks, ensuring the highest product quality.

Syntegon’s SVL 2310 vertical packaging machine is engineered for the efficient handling of lightweight, fragile snacks. Capable of producing up to 110 bags of chips per minute, or 220 bags with the twin version (SVL 2310T) – it offers unmatched speed and flexibility across formats, sizes, designs and materials. 

Its low drop height minimizes breakage, while tool-less format changes, hygienic design, and an intuitive HMI make it highly operator-friendly. Also available as a twin version, combining double output of up to 220 bags per minute with a small footprint, the SVL 2310T allows operating multiple machines on the same floor space. The small footprint and scalable design of the SVL 2310 is useful for manufacturers seeking high throughput without compromising product integrity. 

Efficiency for biscuit manufacturers with Pack 301 

Ashish Deshpande, Managing Director at Syntegon Technology India.

Syntegon’s second highlight is the Pack 301 LS horizontal flow wrapper with an automatic measuring loader (SDML). Designed for a variety of shapes and formats, including round, square or rectangular biscuits and crackers, the Pack 301 packs up to 250 packs per minute (duplex infeed), while maintaining delicate handling. 

The solution is engineered to package market-preferred formats like on-edge flow wraps. Ashish Deshpande, managing director at Syntegon Technology India says, “Our solution is particularly well suited to the trend towards healthier offerings such as gluten-free, low-calorie or high-fiber biscuits with often more delicate textures.” To meet the growing demand for multipack and family pack formats, Syntegon also offers the Pack 301 CS – a next-generation solution.

Service solutions 

Syntegon will present its service solutions at Anuga. Developed for significantly increased machine availability, Syntegon’s customized preventive maintenance help customers with having the right spare parts to simplify maintenance, reduce downtime, and optimize equipment availability. In addition, Syntegon offers customized service agreements, ranging from regular inspections to guaranteed production output. 

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Naresh Khanna – 21 January 2025

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Naresh Khanna
Editor of Indian Printer and Publisher since 1979 and Packaging South Asia since 2007. Trained as an offset printer and IBM 360 computer programmer. Active in the movement to implement Indian scripts for computer-aided typesetting. Worked as a consultant and trainer to the Indian print and newspaper industry. Visiting faculty of IDC at IIT Powai in the 1990s. Also founder of IPP Services, Training and Research and has worked as its principal industry researcher since 1999. Author of book: Miracle of Indian Democracy. Elected vice-president of the International Packaging Press Organization in May 2023. One of the judges for Packaging Sustainability Awards 2024 and 2025.

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