Tuesday, January 22, 2019
Home Tags Laminated

Tag: laminated

Highcon
Corrugation

Highcon launches Euclid IIIC laser diecutter for corrugated

0

Highcon announced on 21 February 2108 at its headquarters in Yavne Israel, the launch of the Highcon Euclid IIIC for cutting and creasing corrugated and fluted substrates from 1 mm up to 3 mm

MOST POPULAR

Load more
Packaging South Asia delivers daily news, updates, analysis, case studies and industry scoops related to the packaging industry of South Asia.
Contact us: editor@ippgroup.in

POPULAR POSTS

POPULAR CATEGORY

© 2018. All content (text and/or media) is intellectual property of IPP Catalog Publications Pvt. Ltd.
error: Content is protected !!