The Shanghai World of Packaging (swop) will happen every year from 2024. Under the Interpack alliance umbrella, the trade fair focuses on the requirements of the local market and aims to strengthen international relations within the processing and packaging industry. This year, the event is being held from 22 – 24 November in Shanghai.
Even before the start of swop 2023, it was clear that the trade fair will already be held again in 2024. One reason is the growing demand from exhibitors and visitors, the organizers said. The shorter cycles of innovation which result from the change in the packaging industry and which especially affect sustainability and digitization also play a role here. The annual rhythm creates a platform to present innovations and developments in the processing and packaging segment in a timely manner. Until now, the rhythm was two years.
“With this step, we recognize the needs of the very dynamic Chinese packaging market”, says Thomas Dohse, director of the Interpack alliance. “A shorter interval between events has been met here with great interest. Regular participation allows companies to increase their visibility, improve customer retention and strengthen their position in the market.”
After the end of the Covid-19 crisis, an ongoing economic recovery can be observed. At the same time, the trade fair industry is regaining strength. For example, the response of exhibitors to swop 2023, jointly organized by Messe Düsseldorf Shanghai and Adsale Exhibition Services, is already large.
The packaging market is growing
With the expansion of the global consumer market and the development of technological innovations, the packaging industry has become an important factor for business growth in China. The industry continues to specialize while focusing on innovation, protecting the environment and sustainability. The presentation of novelties, strengthening technological dialogue and creating new business contacts within the industry have all become especially important, and trade fairs are the ideal platform to achieve these goals.
A perspective on future topics
swop covers a great range of topics, among them artificial intelligence, sustainable packaging, smart factory, printing and labelling, processing and packaging components, manufacture of packaging containers, e-commerce and shipping packages, packaging materials and design as well as personalized packaging. Users receive innovative omni-channel packaging solutions and intelligent processing and packaging production guidelines. This is complimented by an extensive supporting program and special areas.
The next dates
From 22 – 24 November 2023, swop will be held in Shanghai. Around 700 exhibitors and 25,000 visiting professionals from China and abroad are expected. In 2024, swop is scheduled for 18 – 20 November, and will also take place in Shanghai.
