Symposium and Open House at Bobst Italia 27 – 28 May 2015

Gravure technology for coating applications

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Bobst’s activities in the field of coatings for flexible substrates continue to advance at full speed

New roadways for innovation in printing and packagingEss Dee Aluminium and JU host National SeminarOn 20 April 2015, Ess Dee Aluminium and Jadavpur University (JU) hosted a one day National Seminar on innovative application of printing in packaging and printed electronics – new trends – at Jadavpur University. S Bandopadhyay, head of the department, Faculty of Engineering and Technology, JU; Arved C Hubler, director, PM TUC at Chemnitz University, Germany; and Ashis Bhattacharya, managing director, Ess Dee Aluminium addressed the gathering.Ess Dee Aluminium and Jadavpur University hosted a one day National Seminar on innovative application of printing in packaging and printed electronics at Jadavpur UniversityThe prime objective of the National Seminar was round tables on new technology, new trends, new innovations in packaging as well as addressing the major concerns of skill and qualified human resource. The seminar also highlighted the best global practices for benchmarking, cost effectiveness, affordability, environment-friendly and green technologies. Further, the sessions were really informative in determining new innovative theories and practical methods whose effectiveness can be measured and must be added to the list of current challenges for today and tomorrow.

“The Indian packaging Industry, which contributes to a large chunk of the manufacturing industry, is expected to grow at 14% CAGR in the next five years and the worldwide trend will be 5.6% CAGR growth, with an expected market of US$ 78 billion. However, an exponential growth will be witnessed in the Chindonesian region, with India leading the growth trajectory. In view of this paradigm shift, Ess Dee Aluminium and Jadavpur University emancipated this platform to a level of a National Seminar which will offer an excellent opportunity to the future generation to understand the way the industry works and also the need to innovate for survival,” said Bhattacharya.

The National Seminar on Innovative Technology of Printing in Packaging & Printed Electronics served as a platform for stakeholders from around the globe to present theories, research findings and special topic sessions to focus on today’s marketplace challenges and how to innovate to meet the same.