The laboratory condensing
apparatus used at Massachusetts
Institute of Technology (MIT) to
measure heat transfer performance
under simulated power plant
conditions of temperature and
pressure
In a major technological boost for the surface coatings industry, a new application has been devised based on an initiated chemical vapor deposition (iCVD) technique, which allows the coating to be applied for original equipment manufacturer(OEM) or retrofit applications. Using very small amount of polymer precursors, a chemical reaction is carried out that covalently grafts an ultra-thin polymer film to any metal surface, such as stainless steel, titanium, copper, aluminium and even polymers and ceramics. This innovation by a US-based start-up, DropWise Technologies, will enable Henkel Adhesive Technologies drive its innovation capabilities forward, as it has signed a joint development agreement with the startup.
“Collaborating with promising startups that provide access to cutting-edge future technologies is an integral part of our innovation strategy. We can combine their unique technologies with our global market access and know-how in coatings to generate profitable growth for both the partners,” says Mike Olosky, corporate senior vice president and global head of innovation and new business development, Henkel Adhesive Technologies.
“We are very excited to be partnering with a global leader in metal surface treatment. Henkel’s strong track record of bringing new innovations to their customers will enable us to fast-track commercialization in key market areas,” says Adam Paxson, CEO of DropWise.
Increase in efficiency
One fine example of DropWise’s hydrophobic coating is in condensing heat exchangers, where the technology increases the efficiency by eliminating the insulating film of liquid that typically builds up on the surface.
Increasing the efficiency of these systems allows for reductions in fuel consumption, emissions and coolant water use, particularly for thermal power plants, which are the largest contributors to global emissions and the second largest consumers of water.
Target applications include industrial heat exchangers such as steam condensers in power plants, heating-ventilation, automotive air-conditioning and chemical processes.
The impact, resilience, and growth of responsible packaging in a wide region are daily chronicled by Packaging South Asia.
A multi-channel B2B publication and digital platform such as Packaging South Asia is always aware of the prospect of new beginnings and renewal. Its 16-year-old print monthly, based in New Delhi, India has
demonstrated its commitment to progress and growth. The Indian and Asian packaging industries have shown resilience in the face of ongoing challenges over the past three years.
As we present our publishing plan for 2023, India’s real GDP growth for the financial year ending 31 March 2023 will reach 6.3%. Packaging industry growth has exceeded GDP growth even when allowing for inflation in the past three years.
The capacity for flexible film manufacturing in India increased by 33% over the past three years. With orders in place, we expect another 33% capacity addition from 2023 to 2025. Capacities in monocartons, corrugation, aseptic liquid packaging, and labels have grown similarly. The numbers are positive for most of the economies in the region – our platform increasingly reaches and influences these.
Even given the disruptions of supply chains, raw material prices, and the challenge of responsible and sustainable packaging, packaging in all its creative forms and purposes has significant headroom to grow in India and Asia. Our context and coverage engulf the entire packaging supply chain – from concept to shelf and further – to waste collection and recycling. We target brand owners, product managers, raw material suppliers, packaging designers and converters, and recyclers.
In an admittedly fragmented and textured terrain, this is the right time to plan your participation and marketing support communication – in our impactful and highly targeted business platform. Tell us what
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