The conference will feature presentations and roundtables by key industry experts, who will share up-to-date information on the market and its growth opportunities and discuss essential topics facing the linerless industry
The AWA International Linerless Label Conference & Exhibition will return on 19-20 November 2026 in Chicago, bringing together suppliers, producers, converters and end users from across the global linerless label industry.
The two-day event will feature presentations, panel discussions, roundtables and networking opportunities, with a focus on the latest developments, innovations, market trends and business challenges shaping the linerless label sector.
Key discussion areas will include whether linerless technology has reached a tipping point, the growth potential of combining RFID with linerless labels, sustainability beyond waste reduction and projections for the linerless market through 2030. The program will also feature perspectives from real-world users of linerless solutions.
Among the featured sessions is a keynote titled ‘From Concept to Application: Driving Linerless Adoption in Logistics and Packaging,’ featuring Robert Bongertman, managing director, Belona B.V., and Karel van den Brink of CEVA Logistics.
Another session will examine the evolution of linerless materials, their relationship with the tape industry and future market opportunities. The session will feature Wilco van Zwieten, CEO, Panoval (Asia).
A panel discussion, ‘Linerless Labels at Scale: Driving Adoption Across Logistics, Retail, and Packaging,’ will explore the factors driving adoption across key end-use sectors and identify emerging opportunities for the technology.
The conference is expected to provide industry stakeholders with insights into the future direction of linerless labeling, including technological innovation, sustainability, market growth and wider adoption across logistics, retail and packaging.
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