KOCH Pac-Systeme has a successful PackPlus 2018


KOCH Pac-Systeme GmbH, a fully owned subsidiary of Uhlmann Group, participated for the first time at an Indian exhibition during the recently concluded PackPlus 2018 held in Delhi. The company showcased its wide range of innovative and complex packaging solutions across different Industry segments such as FMCG, medical devices, batteries and personal care products, among others.

KOCH manufactures complete packaging lines starting from blister/tray forming, sealing, product feeding up to secondary and tertiary packaging, blisters machines as well as complete packaging lines. In India, KOCH Pac Systeme GmbH is represented by Uhlmann India Pvt. Ltd.

“KOCH is increasing its foothold in India and it for improving our visibility further that we decided to participate in PackPlus 2018. We cater to varied packaging requirements across different industry segments, hence we decided to partake in PackPlus 2018 as we are familiar with the extensive coverage and span of this show,” says Umashankar P, country sales manager for KOCH.

According to Umashankar, the event was very productive as KOCH could attract several potential customers and meet many decision makers.

KOCH Pac-Systeme GmbH has several prominent multinational clients in India. “Customers who seek high reliability, automation and value proposition opt for our solutions,” Umashankar informs. He further adds, “We can supply end-to-end solutions: from feeding system up to tertiary packing system. Customers are gradually opting for such end-to-end solutions as they get to deal with a single supplier, the communication becomes seamless and integration of various line components becomes convenient.”

KOCH is also aggressively working towards Industry 4.0 and according to Umashankar, Indian companies too are increasingly eager to know more about this. “Yes, there is a clear trend where we are seeing that Indian customers are enthusiastic to know about the benefits that Internet of Things and Industry 4.0 offer in the overall manufacturing process,” he concludes.

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