Lohia Mechatronik showcased its motor-controlled automatic die kit, ultrasonic + X-ray thickness measurement systems, and defect inspection systems at PlastIndia 2026 in Delhi. The company, along with its international arm SBI Mechatronic Austria, specializes in thickness measurement gauges for sheets and films, as well as extrusion die bolt control systems. With manufacturing facilities in Pune and Austria, the company serves a global customer base with precision-engineered solutions.
One of the key highlights at the show was the company’s motorized bolt controlling system for flat extrusion. Explaining the innovation, Siddharth Lohia, CEO of Lohia Mechatronik, said each bolt in the system is individually motorized to respond to thickness variations in real time. “Our bread and butter has traditionally been thermal bolts, but this new motorized system offers faster precision and enhanced control,” he noted.
Another attraction was the machine vision-based defect inspection system. Designed to detect issues such as unmelted plastic, metallization defects, and contamination, the system leverages artificial intelligence to distinguish between acceptable material and defects. “The entire defect inspection process fundamentally runs on AI, understanding what a defect is and what is not is only possible through AI,” Lohia explained.
The company demonstrated its ultrasonic and X-ray combination thickness measurement device, capable of mapping film thickness edge-to-edge with high accuracy.
Lohia expressed strong optimism about the Indian plastics sector, attributing it to a combination of rising population and increasing per capita plastic consumption. “This double-engine growth will dramatically expand the industry,” he said, adding that responsible usage of plastics remains crucial.
He said automation remains central to Lohia Mechatronik’s philosophy. According to Lohia, the company is committed to reducing manual intervention, minimizing dependency on skilled labor, and enhancing operational efficiency through automation and AI.
Looking ahead, the company plans to strengthen further its capabilities in die automation and expand the technological scope of its sensor-based thickness measurement systems. “These are the two areas we are focusing on for future innovation,” Lohia concluded.
