Taghleef Industries Group (Ti), a global name in packaging and label films, has announced its participation at Interpack 2023, the world’s leading trade fair for the packaging industry. The event will be held from 4-10 May 2023, in Düsseldorf, Germany. Ti will showcase its latest innovations in sustainable and recyclable solutions for packaging and labels.
Taghleef Industries will promote Dynamic Cycle, its innovative platform that reflects its commitment to sustainability. Through Dynamic Cycle, Ti is working to reduce its environmental footprints and provide sustainable products and solutions to its customers.
Taghleef Industries will also highlight its reDESIGN success stories at the event, which illustrate how the company has helped customers switch to more sustainable packaging and label structures. Through these success stories, Ti aims to demonstrate how its innovative solutions can help companies reduce their environmental impact while also achieving their business goals.
As a key player in the packaging industry, Taghleef will launch its Ti Talks Live sessions – high-level discussions with industry experts from the full value chain – covering key topics on the path to sustainable transformation. Attendees will hear from the experts on topics such as market trends, sustainable packaging design, materials innovation, and the circular economy.
“We are excited to be part of Interpack and to showcase our latest innovations in sustainable packaging and labels,” said Patrick Desies, CSMO of Taghleef Industries. “Our Ti Talks Live sessions will give attendees the opportunity to hear firsthand from industry partners about the latest trends, challenges, and opportunities in sustainability.”
Taghleef Industries will be at Hall 9, StandA21. Speakers and panelists from leading companies and organizations including Europen, Flexible Packaging Initiative (FPI), EXPRA, CEFLEX, Go!PHA, European Bioplastics, NatureWorks, TotalEnergies Corbion, Association of Plastic Recyclers (APR), RecyClass, Alliance to End Plastic Waste, and others will attend.