
The World Packaging Organisation (WPO – www.worldpackaging.org) has announced that Pack’t Forum, its global digital platform dedicated to knowledge exchange in the packaging sector, is now fully operational with all functionalities activated.
The initiative marks an important step in strengthening international collaboration among packaging professionals and invites experts, companies, researchers and students to register and begin contributing to what aims to become the world’s most dynamic community for packaging dialogue and innovation.
Designed as a collaborative digital environment, Pack’t Forum brings together professionals from across the entire packaging value chain to discuss technical challenges, exchange practical solutions and share insights on topics such as packaging design, materials, production technologies, sustainability, circular economy and emerging industry trends.
The platform reflects WPO’s mission of promoting better packaging worldwide by making technical knowledge more accessible and encouraging open, constructive dialogue among professionals from different regions and disciplines.
With all platform tools now active, users can fully participate in discussions, ask technical questions, respond to community inquiries and share best practices with peers around the world. Participation is flexible and fully online, allowing professionals to contribute whenever their schedules permit while helping build a collaborative and educational environment for the global packaging community.
According to WPO president Luciana Pellegrino, “The objective of Pack’t Forum is to build a vibrant international ecosystem where knowledge becomes a shared resource and where experienced professionals can inspire the next generation of packaging innovators. By connecting experts, practitioners and students from different countries and disciplines, the platform aims to accelerate the exchange of ideas that can drive better solutions for industry challenges and societal needs.”
She adds. “As the global packaging industry continues to evolve in response to sustainability goals, technological innovation and changing consumer expectations, Pack’t Forum offers a new digital space where the collective intelligence of the industry can come together to shape the future of packaging across the globe.”
Pack’t Forum is open and free to join to professionals worldwide who wish to participate in discussions, answer questions, share experiences and contribute to the advancement of packaging knowledge. WPO encourages companies, academic institutions and individual experts to join and actively engage with the community.
All the ones interested in becoming part of the initiative can register and begin participating at: www.packagingforum.org








