Messe Duesseldorf held a roadshow in Mumbai’s Hotel Leela on 15 November to talk about interpack 2017. The audience comprised of various stakeholders from the packaging industry, both from India and abroad. The gathering was addressed by Werner M. Dornscheidt, chief executive officer and president of Messe Duesseldorf GmbH, Friedbert Klefenz, president – packaging technology, Robert Bosch, GmbH and president of interpack
2017, and NC Saha, director at Indian Institute of Packaging.
Dornscheidt talked about the Save Food program as well as the details about the layout, facilities and visitors who would visit the event. He said that following its debut at interpack 2014, “components for processing and packaging” will return to interpack 2017. Visitors will find the event at a new site within the Düsseldorf Exhibition Centre, in the temporary Hall 18. Industry 4.0 will be in focus and there will be a Technology Lounge at the VDMA
stand, featuring examples of solutions in packaging machinery and process engineering, thus opening up new opportunities for applications in security, traceability, copying and counterfeit protection as well as in customized packaging.
interpack 2017 is expected to see record exhibitors demand as they have booked about 20% more space than was available at the exhibition centre.
Klefenz in his presentation talked about facts and trends being witnessed in the global food packaging industry. He said that the packaged food industry is expected to grow from
EUR 2 trillion in 2015 to EUR 3 trillion in 2020. Asia will be the biggest market followed by Western Europe. Dairy sector will account for the biggest share in the food packaging market followed by baked goods. Some of the challenges faced by the industry is changing consumer behavior, stiff competition globally, rising labor cost, rising energy costs and decreasing margins, Klefenz said. Finally, Saha said that Indian exhibitors and visitors are looking forward to interpack 2017 and there would be more than 50 exhibitors at the event.