PackPlus achieves new landmark in the 2017 show


The Indian packaging, processing and supply chain witnessed a new high in the beginning of August this year. PackPlus 2017, held from 3 to 6 August 2017 at Pragati Maidan in New Delhi, provided a global business and networking platform to the 350+ participating companies from the packaging, processing and supply chain industries and hosted over 80 product launches, more than 200 running machines and several other attractions. The total number of 16,521 unique business visitors over the four days indicates the success of the event as one of the best-attended packaging shows in the country.

Companies that chose PackPlus as their platform for launching some of their innovative products include big names like Modtech Machines, which launched Robotics Case Erector & Case Packer, and Uflex Engineering that offered High Speed Solventless Lamination Machine, High Speed Slitting Machine with Turret System, Pick Fill Seal Machine & High Speed Extruded Snacks Packing Machine. The Bagla Group launched High Speed Automatic Shrink Wrapping Machines from Minipack, Italy and Pap Tech Engineers and Associates unveiled Packaging & Corrugation Testing Equipment.

“We have been participating in PackPlus for the past 5 years and have seen it growing each year. This year we received very good inquiries and finalized six deals. We will be certainly participating in PackPlus 2018 and all its future editions,” said Heena Mistry, manager – marketing, Control Print India, Mumbai.

Several companies participated for the first time and were glad that the show met their expectations. “We exhibited at PackPlus for the first time and got over 500 leads. The show was even better than what we had expected. The response was very good,” said Vijay Adlakha, director, Infinity Advertising Services, Faridabad.

Visitors were equally elated with the experience.

“We got to see all the latest innovations from the industry at one place. We could compare the products, get a clear picture of the machine on how it runs and also had a chance to meet the company personnel face to face. This helped in making quick decisions,” said Nitin Shakti from Pranjal Packaging Services, Chennai.

The show was also adorned by the annual knowledge sharing interactive platform of International Packaging Conclave held on 4 August in the Conference Hall of Pragati Maidan. The conclave, attended by over 175 delegates, delved deep on issues pertaining to safe packaging for a better tomorrow.

“The show at New Delhi has always seen a rise in the participating companies, the product launches and the visitors’ attendance. The industry keeps on creating new opportunities and PackPlus gives them a road to reach the right people. We are glad our hard work always pays and our success speaks volumes about our dedicated approach,” said Neetu Arora, director,, the organizer of the event.

PackPlus 2018 will be held from 25-28 July 2018 at the same venue. For more details, contact


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