Toppan at Tokyo Pack 2022 – 12 to 14 October

Sustainable transformation and digital transformation

Toppan Tokyo Pack 2022
Concept for the Toppan booth at Tokyo Pack 2022  © Toppan

Tokyo – September 26, 2022 – Toppan a global leader in communication, security, packaging, décor materials, and electronics solutions, will participate in Tokyo Pack 2022 at the Tokyo Big Sight exhibition center from October 12 to 14.

Environment-related factors, such as climate change, and the accelerated growth of digital technologies are having a significant impact on people’s lives and economic activity around the world. In its packaging business, Toppan aims to generate value for society and contribute to solutions for social issues through concerted efforts to provide superior products and services based on the concept of Toppan S-Value packaging.

Toppan’s booth at Tokyo Pack 2022 in the East Hall 2-52 – will take the theme of ‘Sustainable challenges for the future and for the world,’ and present the latest developments in products technologies, and solutions. These include SX (sustainable transformation) packages that aim to enhance recyclability and reduce CO2 emissions and DX (digital transformation) solutions that support greater efficiency and sophistication for processes from product manufacture to sales.

Coinciding with its participation in Tokyo Pack 2022, Toppan has launched an event website introducing the solutions that will be on show at the venue. (Japanese)

Main solutions on show

Toppan will showcase the latest developments in products and solutions under the categories of DX and SX based on Toppan S-Value packaging, a brand for contributing to a better society and more comfortable living through packages that offer greater value.

SX (Sustainable Transformation)
Toppan will present multiple SX packaging solutions centered on GL Barrier,¹ which provides world-class barrier performance. These include mono-material packaging, decarbonizing packages that aim to reduce CO2 emissions by employing Toppan’s aluminum-free and other converting technologies, and the use of LCA² to visualize reductions in environmental impact. Toppan will also introduce its global supply chain, which supplies SX packaging solutions worldwide.

DX (Digital Transformation)
Toppan will showcase solutions that leverage DX to provide comprehensive support for enhanced sophistication and efficiency for activities from manufacturing to marketing and sales. Toppan offers a range of DX solutions facilitating productivity improvement and supporting diverse forms of sales. Examples are SDNECT, a service for raising the efficiency of procurement activities between businesses, and Metapa, which allows consumers to shop in metaverse spaces via smartphones.

Toppan will continue to take on the challenge of creating a sustainable society by delivering products and services with value added to markets throughout the world.

1. GL Barrier is Toppan’s proprietary range of transparent barrier films. With world-class barrier performance enabled by unique vapor deposition and coating technologies and an extensive lineup for diverse applications, GL BARRIER is a leading transparent barrier film brand recognized in markets throughout the world, including Japan, Europe, the Americas, and Asia. For more information, visit

2. Life Cycle Assessment (LCA) is a method for quantitative assessment of resources input and environmental impact of emissions across the entire life cycle of a product, from raw materials (resource extraction to raw material manufacture) to product manufacture, use, recycling, and disposal.

The impact, resilience, and growth of responsible packaging in a wide region are daily chronicled by Packaging South Asia.

A multi-channel B2B publication and digital platform such as Packaging South Asia is always aware of the prospect of new beginnings and renewal. Its 16-year-old print monthly, based in New Delhi, India has demonstrated its commitment to progress and growth. The Indian and Asian packaging industries have shown resilience in the face of ongoing challenges over the past three years.

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