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Packaging South Asia
  • Home
  • Categories
    • Automation
    • Consumables
      • Aluminium
      • Coating
      • Flexible films and laminates
      • Flexo plates
      • Foils
      • Gravure Cylinder
      • Inks
      • Label stock
      • Masterbatches
      • Offset plates
      • Paper & Converting
      • Paperboard
      • Polymers
      • Solvents
    • APPLICATIONS
    • Sustainability & Health
    • Equipment + Software
    • Events
    • Invest, M&A, JV
    • Supply Chain
    • Type of Packaging
      • Corrugation
      • Monocartons
      • Litho Laminated Corrugated Curtain
      • Liquid packaging cartons
      • Labels
      • Smart Packaging
      • Metal packaging
      • Glass Packaging
      • Flexible Packaging
      • Flexible films and laminates
      • Rigid packaging
    • Technology
    • Brand Security
    • Labels
    • Corrugation
    • Metal packaging
    • Design & Marketing
    • Editorial
    • Filling and Sealing
    • Flexible Packaging
    • Liquid Packaging
    • Industry News
    • Monocartons
    • Polymers
    • Track and trace
    • Recycling
    • Research
  • Subscriptions
  • Advertise
  • Labels
  • Events
    • AIPIA
    • Anuga Food Tec
    • Bharat Print Expo
    • Chinaplas
    • CPHI & PMEC
    • DrinkTec
    • Elite Conferences
    • Flexo Summit Asia
    • Interpack
    • Intrapac
    • IndiaCorr Expo
    • Labelexpo
    • Metpack
    • ProPak Asia
    • PackPlus
    • Printpack
    • ProPak India
    • Plastindia
    • Pamex
    • PaperEx
    • PackPlus
  • FoodTekPack
  • PSAC
  • Videos

Brand Security

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Holostik

Holostik Group shines at FIPSA 2026 Responsible Packaging Awards

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Xeikon’s Ecolyne digital press subscription model gears up for Indian market

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Fasiculus highlights digital packaging solutions to tackle counterfeiting

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Leading European flexible packaging converter Südpack on 7C–SPQ

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Finland’s ambassador to India, HE Kimmo Lähdevirta makes his opening remarks to the afternoon public session of the Think Circle event at Finland embassy on 10 January 2025 Photo PSA

Huhtamaki India and Finland Embassy host Think Circle 2nd edition

Naresh Khanna - January 12, 2025
Parksons

Parksons Packaging’s maiden show at CPHI & PMEC India 2024

Aayush Pandey - January 4, 2025
ASPA

ASPA expands international presence

PSA Desk - December 10, 2024
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Siegwerk India’s Dr. Dipshikha Banerjee on sustainable inks and coatings

Naresh Khanna - October 18, 2024
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ASPA

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Holostik

Holostik at PackPlus 2024 with anti-counterfeiting solutions

Aayush Pandey - August 29, 2024
Holostik

Holostik’s paper holograms and security labels at Pack Plus

Nilutpal Thakur - August 19, 2024
Hybrid updates iC3D software

Hybrid updates iC3D software

Nessan Cleary - August 15, 2024
Avery Dennison introduces RFID inlays for industrial M800 applications

Avery Dennison introduces RFID inlays for industrial M800 applications

PSA Desk - August 8, 2024
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Packaging South Asia delivers daily news, updates, analysis, case studies and industry scoops related to the packaging industry of South Asia.
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