Array of concepts and applications at HP stand

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At the upcoming Pack Expo Las Vegas, HP will have an array of concepts, applications, demonstrations, interactive sessions and more during the three days of the event from 25-27 September 2018.

HP will present a mixed reality tour of its solutions for packaging with Microsoft HoloLens, the first self-contained, holographic computer that will enable customers to engage with HP digital presses contained in the world around them.

Another highlight of Pack Expo will be the Big Box of Ideas, which will help visitors immerse into the world of corrugated packaging and learn how HP is transforming the industry.

Visitors to HP’s Pack Expo stand can also see how HP can produce variable packaging. The company will be at Stand S-6507.