Tag: Packaging
Mettler-Toledo at Interpack 2026
At Interpack 2026, Mettler-Toledo Product Inspection (Hall 11 Stand A60), a global leader in precision instruments and inspection solutions, will demonstrate how manufacturers can...
Abhay Sheth Technologies at PlastIndia 2026
Abhay Sheth Technologies, as representatives of Huilong Plastics Machinery, will showcase its range of single-head co-ex extrusion coating and lamination machines, as well as...
Aditya Polymers’ adhesive portfolio at Pamex 2026
Aditya Polymers, a manufacturer of industrial and packaging adhesives, will showcase its range of adhesive solutions designed for the printing, packaging, and paper conversion...
Borealis invests 49m Euros in Burghausen site
Borealis, one of the world’s leading providers of advanced and sustainable polyolefin solutions, has announced a 49 million Euros strategic investment to scale up...
Focus on sustainable barrier packaging at MeetingPack Valencia
MeetingPack 2026, a leading event for innovation in barrier packaging, will hold its seventh edition on 21 and 22 April 2026, at the Museu...
Becker India opens new assembly unit in Pune
Becker India, a manufacturer of vacuum and pneumatic equipment, has announced the opening of a new assembly unit in Pune, a development that takes...
Act now to eliminate plastic packaging pollution
Plastic pollution has been a major cause of concern for environmentalists as well as the industry, which has been trying to find sustainable alternatives...
The new Leak-master Mapmax for inline leak testing
Packaging must be leak-proof – without exception. Even a single leak can lead to spoilage, returns and a loss of trust. With the Leak-master...
Hora Arts’ labels, flexible, and carton packaging
Hora Arts, a Noida-headquartered packaging solutions provider of labels, flexible, and carton packaging, showcased its range of products at Bharat Pack Expo 2025 in...
Toppan’s new lines at Niigata & Ishikawa
Toppan has constructed a new manufacturing line at its Niigata plant for flip chip-ball grid array (FC-BGA) substrates, a form of high-density semiconductor packaging....