Thimm group wins multiple awards with Highcon Technology

Thimm on shortlist for the jury award

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Thimm
Laser can cut structures from corrugated cardboard that were hard to produce so far or not feasible at all.

Thimm pack ‘n’ display recently won five awards in the Obal Roku packaging competition for Czech and foreign companies involved in an exciting packaging solution. The company is on the shortlist for its Highcon digital laser cutting and creasing capabilities for the jury awards. Thimm pack ‘n’ display in the…

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